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Advanced liquid metal cooling for chip, device and system
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ShareAdvanced liquid metal cooling for chip, device and system is a book. It was written by Jing Liu and published by World Scientific in 2022.
Key facts
- author: Jing Liu
- publication date: 2022
- book publisher: World Scientific
- book series: unknown
- earliest publication dates: unknown, unknown, unknown
- book subjects: Liquid metals-Thermal properties, Heat exchangers, Electronic apparatus and appliances-Cooling
Classified as: object
Culture
"Advanced liquid metal cooling for chip, device and system" is one of the books by Jing Liu, books by World Scientific and 2,617,384 books in our database.
- Isbn: 9811245855
- Language: English
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Subjects of Advanced liquid metal cooling for chip, device and system:
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This dashboard is based on data from: The British Library
This content can be used under the CC BY 4.0 license
